描述
IPC-PM05 ASM TECH - GOLD WIRE BALL BONDER配置
無配置OEM 代工型號說明
The Eagle AERO opens a new dimension in high-end IC applications. Thanks to its innovative bonding process (X-Power), copper wire connections can be generated 30 percent faster than with previous bonders. The Eagle AERO can create up to 24 2-millimeter connections per second with a bonding accuracy to 2,0 μm at 3 σ and a ball size that can be reduced to 22 μm.文檔
無文檔
類別
Wire / Wedge / Ball Bonder
上次驗證: 6 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
152922
晶圓尺寸:
未知
年份:
2021
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ASM
Eagle AERO
類別
Wire / Wedge / Ball Bonder
上次驗證: 6 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
152922
晶圓尺寸:
未知
年份:
2021
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
IPC-PM05 ASM TECH - GOLD WIRE BALL BONDER配置
無配置OEM 代工型號說明
The Eagle AERO opens a new dimension in high-end IC applications. Thanks to its innovative bonding process (X-Power), copper wire connections can be generated 30 percent faster than with previous bonders. The Eagle AERO can create up to 24 2-millimeter connections per second with a bonding accuracy to 2,0 μm at 3 σ and a ball size that can be reduced to 22 μm.文檔
無文檔