描述
Introducing the new revolutionary high speed Eagle Xtreme wire bonder specifically designed to cater to the industry’s increasing advanced wire bonding applications. Eagle Xtreme features an ultra-light digital bond head and Dual Coil Linear Motor XY table for high speed bonding. High position and force control resolution gives unprecedented performance in ultra-fine pitch bonding. Fully programmable work holder and indexer system coupled with Windows based operating system provides a user friendly interface for easy setup and conversion.配置
無配置OEM 代工型號說明
The ASMPT EAGLE XTREME is an advanced semiconductor die bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME is designed to provide high-precision die bonding capabilities for semiconductor manufacturing processes.文檔
無文檔
ASM
EAGLE XTREME
已驗證
類別
Wire Bonders
上次驗證: 20 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
79163
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ASM
EAGLE XTREME
類別
Wire Bonders
上次驗證: 20 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
79163
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Introducing the new revolutionary high speed Eagle Xtreme wire bonder specifically designed to cater to the industry’s increasing advanced wire bonding applications. Eagle Xtreme features an ultra-light digital bond head and Dual Coil Linear Motor XY table for high speed bonding. High position and force control resolution gives unprecedented performance in ultra-fine pitch bonding. Fully programmable work holder and indexer system coupled with Windows based operating system provides a user friendly interface for easy setup and conversion.配置
無配置OEM 代工型號說明
The ASMPT EAGLE XTREME is an advanced semiconductor die bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME is designed to provide high-precision die bonding capabilities for semiconductor manufacturing processes.文檔
無文檔