描述
無描述配置
2 ChambersOEM 代工型號說明
The SEZ 323 is a spin-processing system designed for high throughput cleaning and film removal applications for 300 mm semiconductor wafer processing. It has a robot on a linear tracking system that transports wafers from four cassettes to two identical process chambers that can apply up to three chemicals each. The system has a SEMATECH-compliant graphical user interface and touch screen, and offers options such as a retrofit kit for processing 200 mm wafers, a rinse and dry module, endpoint detection, and more. It supports applications such as cleaning, etching, backside etch & clean, silicon substrate etch, and wafer reclaim.文檔
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LAM RESEARCH / SEZ
SP323
已驗證
類別
Wet Etch
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
17769
晶圓尺寸:
12"/300mm
年份:
2002
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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LAM RESEARCH / SEZ
SP323
類別
Wet Etch
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
17769
晶圓尺寸:
12"/300mm
年份:
2002
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
2 ChambersOEM 代工型號說明
The SEZ 323 is a spin-processing system designed for high throughput cleaning and film removal applications for 300 mm semiconductor wafer processing. It has a robot on a linear tracking system that transports wafers from four cassettes to two identical process chambers that can apply up to three chemicals each. The system has a SEMATECH-compliant graphical user interface and touch screen, and offers options such as a retrofit kit for processing 200 mm wafers, a rinse and dry module, endpoint detection, and more. It supports applications such as cleaning, etching, backside etch & clean, silicon substrate etch, and wafer reclaim.文檔
無文檔