描述
Etcher配置
2 Chambers Chuck Size - 8" Open Cassette Port Brooks PRI Robot - LAUDA Heaters (QTY 6) - CHC (QTY 3)OEM 代工型號說明
The SEZ 223 is a spin-processing system designed for high throughput cleaning and film removal applications for semiconductor wafer processing. It has a robot that transports 200mm wafers from four cassettes to two identical process chambers, capable of applying up to three chemicals each. The system has an object-oriented software architecture with a Sematech compliant GUI and Touch Screen. It also has options like Offline process editor, Mini-Environment, DIW-Ozone Processing, SMIF, AGV, Frontside handling, Film Removal End Point Detection, and more. It supports applications such as Copper Backside & Wraparound Clean, Other Backside Metal Cleans, Backside Film Removal, Wafer Reclaim, Post-etch Polymer Removal, Oxide Etching, and Post-CMP-Cleaning.文檔
無文檔
類別
Wet Etch
上次驗證: 10 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
146874
晶圓尺寸:
8"/200mm
年份:
2006
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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LAM RESEARCH / SEZ
SP223
類別
Wet Etch
上次驗證: 10 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
146874
晶圓尺寸:
8"/200mm
年份:
2006
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Etcher配置
2 Chambers Chuck Size - 8" Open Cassette Port Brooks PRI Robot - LAUDA Heaters (QTY 6) - CHC (QTY 3)OEM 代工型號說明
The SEZ 223 is a spin-processing system designed for high throughput cleaning and film removal applications for semiconductor wafer processing. It has a robot that transports 200mm wafers from four cassettes to two identical process chambers, capable of applying up to three chemicals each. The system has an object-oriented software architecture with a Sematech compliant GUI and Touch Screen. It also has options like Offline process editor, Mini-Environment, DIW-Ozone Processing, SMIF, AGV, Frontside handling, Film Removal End Point Detection, and more. It supports applications such as Copper Backside & Wraparound Clean, Other Backside Metal Cleans, Backside Film Removal, Wafer Reclaim, Post-etch Polymer Removal, Oxide Etching, and Post-CMP-Cleaning.文檔
無文檔