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描述
無描述配置
-standard handling with standard chuck and vacuum EEF -RDM module (rinse and dry module for special clean and dry application after process on standard chuck; removes ---chemical residues at frontside after standard process on chuck ) -windows 3.11 operating system (very stable) -very new chemical modules (3pcs) with new chemical controller -standard Brooks ATM robot handlings system -running operating system with tool SW -TestedOEM 代工型號說明
The SEZ 203 Spin-Processor is a single wafer processing system that can use up to three different chemical solutions in a programmable sequence for processing wafers. It is capable of processing wafers with sizes of 125mm, 150mm, and 200mm. It has options like Endpoint Detection System, ozone processing, and contamination-free robot handling. It supports applications such as Photolithography Yield Enhancement, Back Surface Metal Clean, and Silicon Etch. The system can recycle, heat, and filter chemical solutions or use them in a single pass mode.文檔
無文檔
類別
Wet Etch
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
116204
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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LAM RESEARCH / SEZ
SP203
類別
Wet Etch
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
116204
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
-standard handling with standard chuck and vacuum EEF -RDM module (rinse and dry module for special clean and dry application after process on standard chuck; removes ---chemical residues at frontside after standard process on chuck ) -windows 3.11 operating system (very stable) -very new chemical modules (3pcs) with new chemical controller -standard Brooks ATM robot handlings system -running operating system with tool SW -TestedOEM 代工型號說明
The SEZ 203 Spin-Processor is a single wafer processing system that can use up to three different chemical solutions in a programmable sequence for processing wafers. It is capable of processing wafers with sizes of 125mm, 150mm, and 200mm. It has options like Endpoint Detection System, ozone processing, and contamination-free robot handling. It supports applications such as Photolithography Yield Enhancement, Back Surface Metal Clean, and Silicon Etch. The system can recycle, heat, and filter chemical solutions or use them in a single pass mode.文檔
無文檔