描述
無描述配置
無配置OEM 代工型號說明
The EXPEDIUS™ -i is the latest auto wet station succeeding from the EXPEDIUS™ +, a platform featuring further improvements in process performance and productivity. The system has a highly cost effective solution designed for 45nm and beyond technology node for semiconductor manufacturing. The EXPEDIUS™ -i achieved a throughput of 1,000 wafers per hour (a 150% increase compared with the previous model), high productivity, and low Cost of Ownership. Implementation of the chemical treatment and pure water rinse tanks, well-optimized dryer module improves its cleaning and resist stripping performance significantly. The system realized greatly improvement both etch shape control and process stability for the selective etch process. Furthermore, in order to suppress pattern collapse of vulnerable structures, advanced dryer contributes to reduce processing time drastically and collaborate with optimum sequencing, the system achieved shortened throughput times and the highest level of cost performance in the industry.文檔
無文檔
類別
Wet Benches - Auto
上次驗證: 7 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
141877
晶圓尺寸:
12"/300mm
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
TEL / TOKYO ELECTRON
EXPEDIUS-i
類別
Wet Benches - Auto
上次驗證: 7 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
141877
晶圓尺寸:
12"/300mm
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
無配置OEM 代工型號說明
The EXPEDIUS™ -i is the latest auto wet station succeeding from the EXPEDIUS™ +, a platform featuring further improvements in process performance and productivity. The system has a highly cost effective solution designed for 45nm and beyond technology node for semiconductor manufacturing. The EXPEDIUS™ -i achieved a throughput of 1,000 wafers per hour (a 150% increase compared with the previous model), high productivity, and low Cost of Ownership. Implementation of the chemical treatment and pure water rinse tanks, well-optimized dryer module improves its cleaning and resist stripping performance significantly. The system realized greatly improvement both etch shape control and process stability for the selective etch process. Furthermore, in order to suppress pattern collapse of vulnerable structures, advanced dryer contributes to reduce processing time drastically and collaborate with optimum sequencing, the system achieved shortened throughput times and the highest level of cost performance in the industry.文檔
無文檔