描述
無描述配置
post-CMP cleaningOEM 代工型號說明
The new post-CMP cleaner improves throughput by 50% by reducing wafer transfer and drying time. Footprint is also reduced by optimally arranging each processing unit. Moreover, inline configuration with chemical mechanical polisher is also possible.文檔
無文檔
類別
Wet Benches - Auto
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
112096
晶圓尺寸:
6"/150mm
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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AS-2000
類別
Wet Benches - Auto
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
112096
晶圓尺寸:
6"/150mm
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
post-CMP cleaningOEM 代工型號說明
The new post-CMP cleaner improves throughput by 50% by reducing wafer transfer and drying time. Footprint is also reduced by optimally arranging each processing unit. Moreover, inline configuration with chemical mechanical polisher is also possible.文檔
無文檔