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描述
Dual brush and top side brush chambers, spin dry配置
無配置OEM 代工型號說明
The new post-CMP cleaner improves throughput by 50% by reducing wafer transfer and drying time. Footprint is also reduced by optimally arranging each processing unit. Moreover, inline configuration with chemical mechanical polisher is also possible.文檔
無文檔
類別
Wet Benches - Auto
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
107085
晶圓尺寸:
8"/200mm
年份:
1998
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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類別
Wet Benches - Auto
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
107085
晶圓尺寸:
8"/200mm
年份:
1998
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Dual brush and top side brush chambers, spin dry配置
無配置OEM 代工型號說明
The new post-CMP cleaner improves throughput by 50% by reducing wafer transfer and drying time. Footprint is also reduced by optimally arranging each processing unit. Moreover, inline configuration with chemical mechanical polisher is also possible.文檔
無文檔