概述

Engineered for automation and efficiency, the SSEC 3305/6 systems incorporate up to six processing modules, complemented by one, two, or three handling robots, all working synergistically to enable high throughput operation. This setup excels even in managing complex serial processes. These systems present a choice between the robust bulkhead style or the spacious ballroom style, catering to various user preferences. Furthermore, they are designed to support wafers up to 300mm, proving their adaptability and capability in addressing the multifaceted needs of the semiconductor manufacturing sector.