概述

The SSEC 3308/12 systems are entirely automatic, equipped with a maximum of twelve processing modules and the option of one, two, or three handling robots to facilitate high-capacity operations, inclusive of intricate serial processes. These systems are versatile in their design, available in either the bulkhead or the ballroom styles. Moreover, they are capable of supporting wafer sizes up to 300mm, which showcases their adaptability in handling diverse semiconductor manufacturing tasks.