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描述
無描述配置
-Fully automated, dry-in/dry-out single wafer SiC substrate polisher -Configured for 150mm wafer processing -Milara, edge-contact dry robot on linear transfer platform -3 polish modules equipped with dedicated hardware -22" polish tables for constant-flow polish process -High pressure spray bar pad cleaner -Overam spindle with 4 passage rotary union -Slurry flow-controller for 2 lines per table -Integrated spray clean module with Jetspray and 2 fluid lines -Wet wafer transfer module with edge grip wafer flip robot to return wafer orientation to polish side up for cleaning -PEER Group, Windows based software architecture on a Beckhoff PLC control system with wafer lot and slot integrity -Semi S2, S8 and CE certification -Table temperture control unit -Universal Vacuum System -OCR camera -200mm wafer size conversion kit -6EZ Spare Parts KitOEM 代工型號說明
未提供文檔
無文檔
REVASUM
6EZ
類別
Wafer Polishing
上次驗證: 23 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
108406
晶圓尺寸:
未知
年份:
2020
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Refurbishment Services
Available
描述
無描述配置
-Fully automated, dry-in/dry-out single wafer SiC substrate polisher -Configured for 150mm wafer processing -Milara, edge-contact dry robot on linear transfer platform -3 polish modules equipped with dedicated hardware -22" polish tables for constant-flow polish process -High pressure spray bar pad cleaner -Overam spindle with 4 passage rotary union -Slurry flow-controller for 2 lines per table -Integrated spray clean module with Jetspray and 2 fluid lines -Wet wafer transfer module with edge grip wafer flip robot to return wafer orientation to polish side up for cleaning -PEER Group, Windows based software architecture on a Beckhoff PLC control system with wafer lot and slot integrity -Semi S2, S8 and CE certification -Table temperture control unit -Universal Vacuum System -OCR camera -200mm wafer size conversion kit -6EZ Spare Parts KitOEM 代工型號說明
未提供文檔
無文檔