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LOGITECH 1CM53
    描述
    Logitech CDP 1CM53 Chemical Delayering & Planarization CMP Polisher System ***This unit looks to be in great condition. It was excess stock from a refurbishment company. There are 2 connectors that are not plugged in to anything in the bottom. We do not have the facility requirements or expertise to test this unit. We are selling it as-is, for parts or not working as such.*** Key Features: Minimal subsurface damage Wide range of wafer sizes can be polished, up to 200 mm to single integrated circuit (IC) capability Robust, corrosion resistant construction Fine etch polishing of semiconductor wafers and electro-optic crystals Automated process control for repeatable results Description: The CDP automatic allows the operator to achieve industry standards of control and layer removal for traditional CMOS technology, CMP applications, such as STI and Damascene (acceptable Within Wafer Non-Uniformity (WIWNU) and Within Die Non-Uniformity (WIDNU) are achievable). The CDP automatic can also be used for non-traditional planarisation applications, such as hard substrate polishing, Epi-ready surface preparation or wafer reclamation, and will produce accurate and repeatable results to within required measurement parameters. Laser quality surfaces (0/0 scratch dig), improvements to surface topography and Ra to subnanometer levels on substrates are all achievable using the CDP automatic. This level of diversity makes the CDP ideal for the testing of new CMP slurries, pads and templates for off line analysis and for off line trials of new CMP processes without the need to stop production runs. Various process parameters such as: Platen rotational speed Carrier rotational speed, down force, and back pressure Carrier sweep speed and linear travel Platen temperature Slurry flow rate In-situ conditioning of the polishing pad Multiple memory locations for process storage
    配置
    Model Number: 1CM53 Power Requirements: 220-240 VAC, 50-60 Hz, Single Phase, 10 A CE Marked: Yes Additional Information: Platen Size: 19.625"~ Dia. Holder Size: 5"~ Dia. (I believe this is correct. I measured in between 2 white polymer plastic pieces.)
    OEM 代工型號說明
    未提供
    文檔

    無文檔

    verified-listing-icon

    已驗證

    類別
    Wafer Polishing

    上次驗證: 超過60天前

    關鍵商品詳情

    條件:

    Used


    作業狀態:

    Deinstalled / Uncrated


    產品編號:

    128815


    晶圓尺寸:

    未知


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    類似上架商品
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    LOGITECH 1CM53

    LOGITECH

    1CM53

    Wafer Polishing
    年份: 0條件: 二手
    上次驗證超過60天前

    LOGITECH

    1CM53

    verified-listing-icon
    已驗證
    類別
    Wafer Polishing
    上次驗證: 超過60天前
    listing-photo-d6ef659e828044abadb307036d69d744-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/88001/d6ef659e828044abadb307036d69d744/10db4f78d8ae47ad8d1a41ff9c2341fd_logitech1cm53sn840107cmpsystem_mw.jpg
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    關鍵商品詳情

    條件:

    Used


    作業狀態:

    Deinstalled / Uncrated


    產品編號:

    128815


    晶圓尺寸:

    未知


    年份:

    未知


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    Logitech CDP 1CM53 Chemical Delayering & Planarization CMP Polisher System ***This unit looks to be in great condition. It was excess stock from a refurbishment company. There are 2 connectors that are not plugged in to anything in the bottom. We do not have the facility requirements or expertise to test this unit. We are selling it as-is, for parts or not working as such.*** Key Features: Minimal subsurface damage Wide range of wafer sizes can be polished, up to 200 mm to single integrated circuit (IC) capability Robust, corrosion resistant construction Fine etch polishing of semiconductor wafers and electro-optic crystals Automated process control for repeatable results Description: The CDP automatic allows the operator to achieve industry standards of control and layer removal for traditional CMOS technology, CMP applications, such as STI and Damascene (acceptable Within Wafer Non-Uniformity (WIWNU) and Within Die Non-Uniformity (WIDNU) are achievable). The CDP automatic can also be used for non-traditional planarisation applications, such as hard substrate polishing, Epi-ready surface preparation or wafer reclamation, and will produce accurate and repeatable results to within required measurement parameters. Laser quality surfaces (0/0 scratch dig), improvements to surface topography and Ra to subnanometer levels on substrates are all achievable using the CDP automatic. This level of diversity makes the CDP ideal for the testing of new CMP slurries, pads and templates for off line analysis and for off line trials of new CMP processes without the need to stop production runs. Various process parameters such as: Platen rotational speed Carrier rotational speed, down force, and back pressure Carrier sweep speed and linear travel Platen temperature Slurry flow rate In-situ conditioning of the polishing pad Multiple memory locations for process storage
    配置
    Model Number: 1CM53 Power Requirements: 220-240 VAC, 50-60 Hz, Single Phase, 10 A CE Marked: Yes Additional Information: Platen Size: 19.625"~ Dia. Holder Size: 5"~ Dia. (I believe this is correct. I measured in between 2 white polymer plastic pieces.)
    OEM 代工型號說明
    未提供
    文檔

    無文檔

    類似上架商品
    查看全部
    LOGITECH 1CM53

    LOGITECH

    1CM53

    Wafer Polishing年份: 0條件: 二手上次驗證:超過60天前