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描述
Multi-Process CMP配置
Standard Features Include: - Automated control with soft touch key pad - Two platen process for post polish buff - Multiple slurry dispense - In-situ pad conditioner - Material compatibility for medium and low ph slurries (1 – 12) - Down force up to 750lbs. - Controllable wafer back pressure - Polish head clean station - External interface for end point capability Optional Features - Multizone ViPRR carrier upgrade - Temperature controlled platens - SECS II InterfaceOEM 代工型號說明
未提供文檔
無文檔
類別
Wafer Polishing
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
83267
晶圓尺寸:
8"/200mm
年份:
1997
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
IPEC / WESTECH
AVANTI 372M
類別
Wafer Polishing
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
83267
晶圓尺寸:
8"/200mm
年份:
1997
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Multi-Process CMP配置
Standard Features Include: - Automated control with soft touch key pad - Two platen process for post polish buff - Multiple slurry dispense - In-situ pad conditioner - Material compatibility for medium and low ph slurries (1 – 12) - Down force up to 750lbs. - Controllable wafer back pressure - Polish head clean station - External interface for end point capability Optional Features - Multizone ViPRR carrier upgrade - Temperature controlled platens - SECS II InterfaceOEM 代工型號說明
未提供文檔
無文檔