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DISCO DGP8760
  • DISCO DGP8760
  • DISCO DGP8760
  • DISCO DGP8760
  • DISCO DGP8760
  • DISCO DGP8760
  • DISCO DGP8760
  • DISCO DGP8760
  • DISCO DGP8760
  • DISCO DGP8760
  • DISCO DGP8760
  • DISCO DGP8760
  • DISCO DGP8760
  • DISCO DGP8760
描述
無描述
配置
+DFM2700
OEM 代工型號說明
The DGP8760 is a fully automatic grinder/polisher for Φ300 mm wafers developed by DISCO Corporation. It is the predecessor to the DGP8761, which integrates backside grinding and stress relief processing and performs stable thin grinding to thicknesses less than 25 µm.
文檔

無文檔

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已驗證

類別
Wafer Polishing

上次驗證: 6 天前

關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

125959


晶圓尺寸:

8"/200mm, 12"/300mm


年份:

2006


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

DISCO

DGP8760

verified-listing-icon
已驗證
類別
Wafer Polishing
上次驗證: 6 天前
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關鍵商品詳情

條件:

Used


作業狀態:

未知


產品編號:

125959


晶圓尺寸:

8"/200mm, 12"/300mm


年份:

2006


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述
配置
+DFM2700
OEM 代工型號說明
The DGP8760 is a fully automatic grinder/polisher for Φ300 mm wafers developed by DISCO Corporation. It is the predecessor to the DGP8761, which integrates backside grinding and stress relief processing and performs stable thin grinding to thicknesses less than 25 µm.
文檔

無文檔