描述
無描述配置
Back Grinder tape manual mounter for 6 and 8in wafersOEM 代工型號說明
Ultron Systems' Model UH108 Series Wafer Backlapping Film Applicators are the ideal benchtop solutions for your frontside protection tape application requirements. They offer a high degree of repeatable accuracy and are capable of cutting the film to the edge of the wafer -- including the alignment flats -- within 0.005" in less than 20 seconds. A wide range of features and options are available to ensure bubble-free lamination to all sizes and types of wafers.文檔
無文檔
ULTRON SYSTEMS INC / USI
UH108-8
已驗證
類別
Wafer Lapping
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
90074
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ULTRON SYSTEMS INC / USI
UH108-8
類別
Wafer Lapping
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
90074
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
Back Grinder tape manual mounter for 6 and 8in wafersOEM 代工型號說明
Ultron Systems' Model UH108 Series Wafer Backlapping Film Applicators are the ideal benchtop solutions for your frontside protection tape application requirements. They offer a high degree of repeatable accuracy and are capable of cutting the film to the edge of the wafer -- including the alignment flats -- within 0.005" in less than 20 seconds. A wide range of features and options are available to ensure bubble-free lamination to all sizes and types of wafers.文檔
無文檔