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描述
Double Side Polisher/Lapper Powered on testing is available配置
16BF/N Maximum Processing Diameter: mm Work diameter maximum: 335 Carrier specification: DP12×Z200 Carrier root circle: 417.55 Lower plate maximum rotation number: 70 Machine W×D×H: 1890×1410×3110 Machine Weight: 7000OEM 代工型號說明
The Hamei 16B is an innovative lapping machine featuring a non-rotating upper plate design. The upper plate is suspended using a wire, enabling it to effectively track plate movement, resulting in significantly improved productivity. By implementing mass-production techniques, we aim to reduce the overall costs of these machines while maintaining their exceptional performance.文檔
無文檔
關鍵商品詳情
條件:
Used
作業狀態:
Installed / Running
產品編號:
123151
晶圓尺寸:
未知
年份:
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PREFERRED
SELLER
HAMAI
16B
類別
Wafer Lapping
上次驗證: 22 天前
Buyer pays 12% premium of final sale price
關鍵商品詳情
條件:
Used
作業狀態:
Installed / Running
產品編號:
123151
晶圓尺寸:
未知
年份:
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Double Side Polisher/Lapper Powered on testing is available配置
16BF/N Maximum Processing Diameter: mm Work diameter maximum: 335 Carrier specification: DP12×Z200 Carrier root circle: 417.55 Lower plate maximum rotation number: 70 Machine W×D×H: 1890×1410×3110 Machine Weight: 7000OEM 代工型號說明
The Hamei 16B is an innovative lapping machine featuring a non-rotating upper plate design. The upper plate is suspended using a wire, enabling it to effectively track plate movement, resulting in significantly improved productivity. By implementing mass-production techniques, we aim to reduce the overall costs of these machines while maintaining their exceptional performance.文檔
無文檔