描述
vacuum robot( AMAT Producer GT)配置
無配置OEM 代工型號說明
The PRI Automation MagnaTran 8 QuadraFly is an advanced robotic system designed for high-precision wafer handling in a vacuum environment. It features SCARA arm technology and direct drive robotics, allowing the simultaneous exchange of four wafers within a compact swing diameter. The QuadraFly robot's patented tri-axial drive enables it to handle heavier payloads, making it suitable for various applications such as Flip Chip, WLCSP, BDA's, MEMS, GaAS, Laser Bars, and bare silicon. The direct magnetic drive technology enhances reliability by reducing the number of parts and eliminating the need for dynamic seals, leading to fewer failures and improved positional repeatability. This system offers efficient and precise wafer handling with minimized vibration, particle generation, and backlash, making it an ideal choice for semiconductor manufacturing processes.文檔
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BROOKS / PRI AUTOMATION
MAGNATRAN 8
已驗證
類別
Wafer Handling
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
74785
晶圓尺寸:
12"/300mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BROOKS / PRI AUTOMATION
MAGNATRAN 8
已驗證
類別
Wafer Handling
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
74785
晶圓尺寸:
12"/300mm
年份:
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
vacuum robot( AMAT Producer GT)配置
無配置OEM 代工型號說明
The PRI Automation MagnaTran 8 QuadraFly is an advanced robotic system designed for high-precision wafer handling in a vacuum environment. It features SCARA arm technology and direct drive robotics, allowing the simultaneous exchange of four wafers within a compact swing diameter. The QuadraFly robot's patented tri-axial drive enables it to handle heavier payloads, making it suitable for various applications such as Flip Chip, WLCSP, BDA's, MEMS, GaAS, Laser Bars, and bare silicon. The direct magnetic drive technology enhances reliability by reducing the number of parts and eliminating the need for dynamic seals, leading to fewer failures and improved positional repeatability. This system offers efficient and precise wafer handling with minimized vibration, particle generation, and backlash, making it an ideal choice for semiconductor manufacturing processes.文檔
無文檔