描述
Wafer Grinding配置
無配置OEM 代工型號說明
"Advanced nTellect Wafer Grinder, 7AF, renowned for reducing sub-surface damage and improving surface finish with repeatable thickness control. The nTellect Grinder boasts high volume wafer throughput at a low cost, utilizing innovative technologies such as tapeless backgrinding, in-feed technology, in-situ thickness control, force adaptive grinding, linear traversing grind spindles, automated process control, and thin wafer handling. Serving a wide array of applications including integrated circuit backgrinding, silicon on insulator, prime wafers, gallium arsenide, lithium niobate, aluminum titanium carbide for read/write heads, glass, sapphire, and quartz, the nTellect Grinder relies on near-frictionless, force-sensitive infeed mechanics and an intelligent control system, which together increase wafer strength and reduce breakage. Its ultra-stiff air bearing spindles and sub-micron feed rates deliver superior surface finishes. The Grinder also features in-situ digital measurement probes and unique linear traversing grind spindles for optimized throughput and accurate, consistent wafer thicknesses. Lastly, with the addition of Tapeless Backgrinding and ultra-fine grit grind wheels, nTellect is poised to revolutionize thin wafer applications. "文檔
無文檔
STRASBAUGH
7AF
已驗證
類別
Wafer Grinding
上次驗證: 6 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
116964
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
類似上架商品
查看全部
STRASBAUGH
7AF
類別
Wafer Grinding
上次驗證: 6 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
116964
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Wafer Grinding配置
無配置OEM 代工型號說明
"Advanced nTellect Wafer Grinder, 7AF, renowned for reducing sub-surface damage and improving surface finish with repeatable thickness control. The nTellect Grinder boasts high volume wafer throughput at a low cost, utilizing innovative technologies such as tapeless backgrinding, in-feed technology, in-situ thickness control, force adaptive grinding, linear traversing grind spindles, automated process control, and thin wafer handling. Serving a wide array of applications including integrated circuit backgrinding, silicon on insulator, prime wafers, gallium arsenide, lithium niobate, aluminum titanium carbide for read/write heads, glass, sapphire, and quartz, the nTellect Grinder relies on near-frictionless, force-sensitive infeed mechanics and an intelligent control system, which together increase wafer strength and reduce breakage. Its ultra-stiff air bearing spindles and sub-micron feed rates deliver superior surface finishes. The Grinder also features in-situ digital measurement probes and unique linear traversing grind spindles for optimized throughput and accurate, consistent wafer thicknesses. Lastly, with the addition of Tapeless Backgrinding and ultra-fine grit grind wheels, nTellect is poised to revolutionize thin wafer applications. "文檔
無文檔