描述
Backside grind配置
無配置OEM 代工型號說明
The Disco DFG8560 is a Fully Automatic In-Feed Surface Grinder that supports advancements for thinner and larger wafers up to Φ300 mm. It is the successor to the DFG800 series and has inherited grinding specifications with an established reputation1. The equipment weight has been reduced by 1.0 t (20% less than DFG860) while maintaining the same basic specifications and performance level as the 800 series.文檔
無文檔
DISCO
DFG8560
已驗證
類別
Wafer Grinding
上次驗證: 11 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
118476
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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DISCO
DFG8560
類別
Wafer Grinding
上次驗證: 11 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
118476
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Backside grind配置
無配置OEM 代工型號說明
The Disco DFG8560 is a Fully Automatic In-Feed Surface Grinder that supports advancements for thinner and larger wafers up to Φ300 mm. It is the successor to the DFG800 series and has inherited grinding specifications with an established reputation1. The equipment weight has been reduced by 1.0 t (20% less than DFG860) while maintaining the same basic specifications and performance level as the 800 series.文檔
無文檔