We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. 閱讀詳情
描述
無描述配置
無配置OEM 代工型號說明
The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.文檔
無文檔
類似上架商品
查看全部
PREFERRED
SELLER
DISCO
DFG850
類別
Wafer Grinding
上次驗證: 超過60天前
Buyer pays 12% premium of final sale price
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
115168
晶圓尺寸:
未知
年份:
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
無配置OEM 代工型號說明
The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.文檔
無文檔