描述
無描述配置
無配置OEM 代工型號說明
The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.文檔
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DISCO
DFG850
類別
Wafer Grinding
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
Deinstalled
產品編號:
136528
晶圓尺寸:
未知
年份:
2003
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
無配置OEM 代工型號說明
The Disco DFG850 system features two air bearing grind spindles, a rotating table with three rotating vacuum wafer chucks, and robotic load/unload operation. This provides high-quality ultra-thin grinding for applications including 3D integration, BSI, bonded wafers, IC slim cards, and more.文檔
無文檔