描述
Slicer Fully automatic grinder. This equipment operates reliably and is suitable for grinding semiconductor materials. Equipped with the original control system and safety guard, featuring a touchscreen interface. Spindle rated power: 4.2 kW; rated torque: 5.9 N·m; speed range: 1,000 to 7,000 min⁻¹.配置
無配置OEM 代工型號說明
The Disco DAG810 is a compact, automatic grinder for workpieces up to 8 inches in diameter. It has one spindle and one chuck table and is designed to process a variety of materials. It has a relatively small footprint of only 11 square feet.文檔
無文檔
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DISCO
DAG810
類別
Wafer Grinding
上次驗證: 13 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
140557
晶圓尺寸:
未知
年份:
2016
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Slicer Fully automatic grinder. This equipment operates reliably and is suitable for grinding semiconductor materials. Equipped with the original control system and safety guard, featuring a touchscreen interface. Spindle rated power: 4.2 kW; rated torque: 5.9 N·m; speed range: 1,000 to 7,000 min⁻¹.配置
無配置OEM 代工型號說明
The Disco DAG810 is a compact, automatic grinder for workpieces up to 8 inches in diameter. It has one spindle and one chuck table and is designed to process a variety of materials. It has a relatively small footprint of only 11 square feet.文檔
無文檔