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描述
ACCRETECH also offers the "RM option", having the additional process of the tape removing for thinner wafer after the tape mounting, in addition to the standard process of PG300/200. nThe RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames. nPerforms the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine. nAll the processes are completed without moving the wafer on the same chuck table. nThe smallest footprint in the world. nEnvironmental - friendly - subsurface damage reduction without chemicals. nEnvironmental - friendly - subsurface damage reduction without chemicals.配置
PG3000RM/200RMOEM 代工型號說明
未提供文檔
無文檔
類別
Wafer Grinding
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
79210
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ACCRETECH / TSK
PG3000RM
類別
Wafer Grinding
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
79210
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
ACCRETECH also offers the "RM option", having the additional process of the tape removing for thinner wafer after the tape mounting, in addition to the standard process of PG300/200. nThe RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames. nPerforms the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine. nAll the processes are completed without moving the wafer on the same chuck table. nThe smallest footprint in the world. nEnvironmental - friendly - subsurface damage reduction without chemicals. nEnvironmental - friendly - subsurface damage reduction without chemicals.配置
PG3000RM/200RMOEM 代工型號說明
未提供文檔
無文檔