SUSS MicroTec offers a wide product portfolio of high quality process solutions for the semiconductor industry and related markets. SUSS portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding, and photomask processing, complemented by micro-optical components.

SUSS MicroTec / KARL SUSS

SB6/8 Gen2 SUSS MicroTec provides a semi-automated platform for multiple bonding processes. Handling wafers up to 200mm as well as various shapes and types of substrates the SB6/8 Gen2 presents itself as a flexible tool for various applications and process environments. The SB6/8 Gen2 is suitable for packaging as well structuring meeting the requirements for MEMS, LED, advanced packaging, 2,5D integration, and 3D integration.

SB6 Gen2 - from pieces up to 150mm wafers.

Wafer Bonder

SUSS MicroTec / KARL SUSS

SB6 Gen2

Wafer Bonders

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SB6 Gen2

Wafer Bonders

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