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APPLIED MICROENGINEERING LTD (AML) ROCK 08
  • APPLIED MICROENGINEERING LTD (AML) ROCK 08
  • APPLIED MICROENGINEERING LTD (AML) ROCK 08
  • APPLIED MICROENGINEERING LTD (AML) ROCK 08
  • APPLIED MICROENGINEERING LTD (AML) ROCK 08
  • APPLIED MICROENGINEERING LTD (AML) ROCK 08
  • APPLIED MICROENGINEERING LTD (AML) ROCK 08
  • APPLIED MICROENGINEERING LTD (AML) ROCK 08
  • APPLIED MICROENGINEERING LTD (AML) ROCK 08
  • APPLIED MICROENGINEERING LTD (AML) ROCK 08
描述
無描述
配置
無配置
OEM 代工型號說明
Wafer Bonder The Rock Aligner Bonders are designed for bonding under Ultra High Vacuum conditions, in the 10-8 mbar range. The Rock systems offer the same aligning and bonding capabilities as the AWB systems, and the UHV vacuum levels are achieved through the use of fully-integrated Cryopump. Technical Features: In-situ alignment (visible and IR illumination) with 1pm accuracy Chamber pressure from 10-8 bar range to 2 bar absolute Wafer separation up to 30mm (multi stack bonding possible) Independent platen temperatures up to 560°C Radical activation for low temperature direct bonding Bonding forces up to 40 kN Anodic bonding voltage up to 2.5 kV Triple stack anodic bonding UV curing option NIR camera option
文檔

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類別
Wafer Bonders

上次驗證: 超過60天前

關鍵商品詳情

條件:

Used


作業狀態:

Installed / Idle


產品編號:

80255


晶圓尺寸:

6"/150mm


年份:

2020


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

APPLIED MICROENGINEERING LTD (AML)

ROCK 08

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已驗證
類別
Wafer Bonders
上次驗證: 超過60天前
listing-photo-69cfb1135ab3478eaade64df58a450b1-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/52548/69cfb1135ab3478eaade64df58a450b1/08ae3840b2ca4df8a486324d696dd46c_6af6779701434a7994e221837144ba8f_mw.jpeg
listing-photo-69cfb1135ab3478eaade64df58a450b1-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/52548/69cfb1135ab3478eaade64df58a450b1/a60f8200fa2847ab9fbe701193cc972d_fcad5caadaa3422cade5032099fa53821201a_mw.jpeg
listing-photo-69cfb1135ab3478eaade64df58a450b1-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/52548/69cfb1135ab3478eaade64df58a450b1/6866b811f5fe4f84a93c0c93f9c12225_4e67ec6301294fd991e84f75e3721699_mw.jpeg
listing-photo-69cfb1135ab3478eaade64df58a450b1-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/52548/69cfb1135ab3478eaade64df58a450b1/9f8f0351edd847fe8628be394d68ea71_8ae6dc3266204a13ac41fae7798d35b4_mw.jpeg
listing-photo-69cfb1135ab3478eaade64df58a450b1-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/52548/69cfb1135ab3478eaade64df58a450b1/9ce1479f767a441eaf5ce1a107c91094_02bdb7680a5c4c229e3ad8131c4cedba_mw.jpeg
listing-photo-69cfb1135ab3478eaade64df58a450b1-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/52548/69cfb1135ab3478eaade64df58a450b1/5060c077a8be45ec9a6de2e0fccc6532_50e200b8239c4db1a5a93fbf312626e1_mw.jpeg
listing-photo-69cfb1135ab3478eaade64df58a450b1-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/52548/69cfb1135ab3478eaade64df58a450b1/6d32e3b2cc6f4f1a8db2f2d20fff0b47_977309334b424127bbd04a508c9bf5f3_mw.jpeg
listing-photo-69cfb1135ab3478eaade64df58a450b1-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/52548/69cfb1135ab3478eaade64df58a450b1/84b7c0442f38448f99a6f2f4d40e3c12_3c0bedd583cf4f1ebea872e4193e96e1_mw.jpeg
listing-photo-69cfb1135ab3478eaade64df58a450b1-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/52548/69cfb1135ab3478eaade64df58a450b1/9fa48e89e36e43ee9e2d6548ffc5d651_32a7dcf16141452a833370f90f56fdf41201a_mw.jpeg
關鍵商品詳情

條件:

Used


作業狀態:

Installed / Idle


產品編號:

80255


晶圓尺寸:

6"/150mm


年份:

2020


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述
配置
無配置
OEM 代工型號說明
Wafer Bonder The Rock Aligner Bonders are designed for bonding under Ultra High Vacuum conditions, in the 10-8 mbar range. The Rock systems offer the same aligning and bonding capabilities as the AWB systems, and the UHV vacuum levels are achieved through the use of fully-integrated Cryopump. Technical Features: In-situ alignment (visible and IR illumination) with 1pm accuracy Chamber pressure from 10-8 bar range to 2 bar absolute Wafer separation up to 30mm (multi stack bonding possible) Independent platen temperatures up to 560°C Radical activation for low temperature direct bonding Bonding forces up to 40 kN Anodic bonding voltage up to 2.5 kV Triple stack anodic bonding UV curing option NIR camera option
文檔

無文檔