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APPLIED MICROENGINEERING LTD (AML) ROCK 08
    描述
    無描述
    配置
    無配置
    OEM 代工型號說明
    Wafer Bonder The Rock Aligner Bonders are designed for bonding under Ultra High Vacuum conditions, in the 10-8 mbar range. The Rock systems offer the same aligning and bonding capabilities as the AWB systems, and the UHV vacuum levels are achieved through the use of fully-integrated Cryopump. Technical Features: In-situ alignment (visible and IR illumination) with 1pm accuracy Chamber pressure from 10-8 bar range to 2 bar absolute Wafer separation up to 30mm (multi stack bonding possible) Independent platen temperatures up to 560°C Radical activation for low temperature direct bonding Bonding forces up to 40 kN Anodic bonding voltage up to 2.5 kV Triple stack anodic bonding UV curing option NIR camera option
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    APPLIED MICROENGINEERING LTD (AML)

    ROCK 08

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    已驗證

    類別
    Wafer Bonders

    上次驗證: 超過30天前

    關鍵商品詳情

    條件:

    Used


    作業狀態:

    Installed / Idle


    產品編號:

    80255


    晶圓尺寸:

    6"/150mm


    年份:

    2020

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
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    APPLIED MICROENGINEERING LTD (AML) ROCK 08

    APPLIED MICROENGINEERING LTD (AML)

    ROCK 08

    Wafer Bonders
    年份: 2020條件: 二手
    上次驗證超過30天前

    APPLIED MICROENGINEERING LTD (AML)

    ROCK 08

    verified-listing-icon
    已驗證
    類別
    Wafer Bonders
    上次驗證: 超過30天前
    listing-photo-69cfb1135ab3478eaade64df58a450b1-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/52548/69cfb1135ab3478eaade64df58a450b1/08ae3840b2ca4df8a486324d696dd46c_6af6779701434a7994e221837144ba8f_mw.jpeg
    listing-photo-69cfb1135ab3478eaade64df58a450b1-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/52548/69cfb1135ab3478eaade64df58a450b1/a60f8200fa2847ab9fbe701193cc972d_fcad5caadaa3422cade5032099fa53821201a_mw.jpeg
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    listing-photo-69cfb1135ab3478eaade64df58a450b1-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/52548/69cfb1135ab3478eaade64df58a450b1/9fa48e89e36e43ee9e2d6548ffc5d651_32a7dcf16141452a833370f90f56fdf41201a_mw.jpeg
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    Installed / Idle


    產品編號:

    80255


    晶圓尺寸:

    6"/150mm


    年份:

    2020


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    無描述
    配置
    無配置
    OEM 代工型號說明
    Wafer Bonder The Rock Aligner Bonders are designed for bonding under Ultra High Vacuum conditions, in the 10-8 mbar range. The Rock systems offer the same aligning and bonding capabilities as the AWB systems, and the UHV vacuum levels are achieved through the use of fully-integrated Cryopump. Technical Features: In-situ alignment (visible and IR illumination) with 1pm accuracy Chamber pressure from 10-8 bar range to 2 bar absolute Wafer separation up to 30mm (multi stack bonding possible) Independent platen temperatures up to 560°C Radical activation for low temperature direct bonding Bonding forces up to 40 kN Anodic bonding voltage up to 2.5 kV Triple stack anodic bonding UV curing option NIR camera option
    文檔

    無文檔

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    查看全部
    APPLIED MICROENGINEERING LTD (AML) ROCK 08

    APPLIED MICROENGINEERING LTD (AML)

    ROCK 08

    Wafer Bonders年份: 2020條件: 二手上次驗證: 超過30天前