描述
無描述配置
無配置OEM 代工型號說明
Wafer Bonder The Rock Aligner Bonders are designed for bonding under Ultra High Vacuum conditions, in the 10-8 mbar range. The Rock systems offer the same aligning and bonding capabilities as the AWB systems, and the UHV vacuum levels are achieved through the use of fully-integrated Cryopump. Technical Features: In-situ alignment (visible and IR illumination) with 1pm accuracy Chamber pressure from 10-8 bar range to 2 bar absolute Wafer separation up to 30mm (multi stack bonding possible) Independent platen temperatures up to 560°C Radical activation for low temperature direct bonding Bonding forces up to 40 kN Anodic bonding voltage up to 2.5 kV Triple stack anodic bonding UV curing option NIR camera option文檔
無文檔
APPLIED MICROENGINEERING LTD (AML)
ROCK 08
已驗證
類別
Wafer Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
Installed / Idle
產品編號:
80255
晶圓尺寸:
6"/150mm
年份:
2020
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MICROENGINEERING LTD (AML)
ROCK 08
類別
Wafer Bonders
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
Installed / Idle
產品編號:
80255
晶圓尺寸:
6"/150mm
年份:
2020
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
無配置OEM 代工型號說明
Wafer Bonder The Rock Aligner Bonders are designed for bonding under Ultra High Vacuum conditions, in the 10-8 mbar range. The Rock systems offer the same aligning and bonding capabilities as the AWB systems, and the UHV vacuum levels are achieved through the use of fully-integrated Cryopump. Technical Features: In-situ alignment (visible and IR illumination) with 1pm accuracy Chamber pressure from 10-8 bar range to 2 bar absolute Wafer separation up to 30mm (multi stack bonding possible) Independent platen temperatures up to 560°C Radical activation for low temperature direct bonding Bonding forces up to 40 kN Anodic bonding voltage up to 2.5 kV Triple stack anodic bonding UV curing option NIR camera option文檔
無文檔