描述
Wafer Bonder配置
無配置OEM 代工型號說明
Wafer to Wafer Bonding - Fully auto-process, with manual wafer loading文檔
無文檔
APPLIED MICROENGINEERING LTD (AML)
AWB-08
已驗證
類別
Wafer Bonders
上次驗證: 19 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
101816
晶圓尺寸:
8"/200mm
年份:
2002
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MICROENGINEERING LTD (AML)
AWB-08
類別
Wafer Bonders
上次驗證: 19 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
101816
晶圓尺寸:
8"/200mm
年份:
2002
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Wafer Bonder配置
無配置OEM 代工型號說明
Wafer to Wafer Bonding - Fully auto-process, with manual wafer loading文檔
無文檔