概述

The FusionPS3 is a 300mm photostabilization system designed for photoresist curing, low-k curing, and non-volatile memory charge erasure. It supports the integration of advanced materials into mainstream device production and maximizes intermolecular reactions to deliver consistent and stable resist characteristics. The FusionPS3 incorporates leading-edge photoresist curing capabilities in a unique, dual-chamber platform, enabling simultaneous processing of different recipes. It guarantees maximum machine uptime, high productivity, and lower cost of ownership, meeting the stringent requirements of 300mm production capability.