描述
無描述配置
Film thickness measurementOEM 代工型號說明
MetaPULSE 200 is the first production-worthy opaque film metrology tool that can simultaneously measure the individual thicknesses of up to six layers in a multi-layer metal (MLM) film stack. It can measure single or multi-layer thicknesses on product wafers with Angstrom accuracy and sub-Angstrom repeatability at up to 60 wafers per hour. The tool uses picosecond ultrasonic laser sonar (PULSE TechnologyTM), a non-contact, non-destructive measurement technique based on laser-induced ultrasound. Its pattern recognition allows it to reliably place its 10 µm measurement spot within existing metrology sites for reliable on-product measurement. MetaPULSE 200 can also diagnose film adhesion and interlayer-reaction problems, measure the RMS roughness of top- and buried-layers, and determine material properties such as silicide phase. This provides critical information about the product’s film stack, which is not available when using single-layer monitor wafer metrology. The system’s broad range of capabilities allows it to significantly reduce the use of monitor wafers in controlling cluster tool MLM deposition, leading to substantial cost and time savings.文檔
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ONTO / RUDOLPH / AUGUST
MetaPULSE 200
已驗證
類別
Thin Film / Film Thickness
上次驗證: 30 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
116860
晶圓尺寸:
8"/200mm
年份:
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ONTO / RUDOLPH / AUGUST
MetaPULSE 200
類別
Thin Film / Film Thickness
上次驗證: 30 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
116860
晶圓尺寸:
8"/200mm
年份:
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
Film thickness measurementOEM 代工型號說明
MetaPULSE 200 is the first production-worthy opaque film metrology tool that can simultaneously measure the individual thicknesses of up to six layers in a multi-layer metal (MLM) film stack. It can measure single or multi-layer thicknesses on product wafers with Angstrom accuracy and sub-Angstrom repeatability at up to 60 wafers per hour. The tool uses picosecond ultrasonic laser sonar (PULSE TechnologyTM), a non-contact, non-destructive measurement technique based on laser-induced ultrasound. Its pattern recognition allows it to reliably place its 10 µm measurement spot within existing metrology sites for reliable on-product measurement. MetaPULSE 200 can also diagnose film adhesion and interlayer-reaction problems, measure the RMS roughness of top- and buried-layers, and determine material properties such as silicide phase. This provides critical information about the product’s film stack, which is not available when using single-layer monitor wafer metrology. The system’s broad range of capabilities allows it to significantly reduce the use of monitor wafers in controlling cluster tool MLM deposition, leading to substantial cost and time savings.文檔
無文檔