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KLA FLX 2908
    描述
    KLA-Tencor FleXus FLX-2908 Thin Film Stress Measurement Test System Description: The Tencor FLX-2900 is a thin-film stress measurement instrument. It accurately measures the changes in the radius of curvature of the substrate caused by the deposition of a stressed thin film. Some of the features include: Accurate stress measurement on all types of films including metals, oxides, and polyimides. You can also measure stress as a function of time or temperature (maximum temperature 900°C). The software displays time-dependent and stress-temperature measurements automatically in graph form. An optical design that positions the laser scanning system below the furnace thus reducing noise during heating and cooling. This feature permits you to observe subtle changes in film stress. Inert atmosphere capability allows the measurements to be made in a controlled atmosphere of nitrogen or argon. Ability to customize parameters such as number of scan points, elastic modulus, substrate thickness, and wafer diameter in the process programs. You can also specify heating and cooling cycles for stress-temperature measurement. Ability to edit data records, plot graphs, and trend charts, and recalculate the stress for a saved ata file by changing the elastic modulus, wafer, or film thickness. Comprehensive data analysis capabilities that include calculating the biaxial modulus of elasticity and thermal expansion coefficient, displaying thermal stress superimposed on stress-temperature measurement data, file subtraction, and stress uniformity. Menus, screens, and windows are simple and easy to use. Key operation for each field is usually displayed at the bottom of the screen. Performance Specifications: Substrate Diameter: 100-mm (4-in.), 125-mm (5-in.), 150-mm (6-in.), and 200 mm (8-in.) wafers. Note the 200-mm (8-in.) wafer is an option. Measurement: Speed: 5 sec. for 150-mm wafer Range: 2 x 107 to 2 x 1010 dyne/cm2 Minimum Radius: 3.8 m Minimum Scan Step: 0.02 mm RMS Noise: < 0.0001 m-1 (radius = 10,000 m) at room temperature Maximum Points Per Scan: 1250 Temperature Range: Room temperature to 900°C Repeatability: The main source of repeatability error is the replacement accuracy of wafers. The typical Tencor Instruments 1 σ error in 1/R is 1 x 10-7 dynes/cm2 for a 1-µm film on a 525 µm silicon substrate. Thicker films and thinner substrates will result in smaller errors and thinner films and thicker substrates will result in larger errors. Operating Specifications: Light Source: Two lasers: 4-mW solid state (GaA1As) laser with wave-length 670 nm and 4-mW solid state (GaA1As) laser with wavelength 750 nm Physical Specifications: FLX-2900 Instrument: 53.3 cm x 60.9 cm x 45.7 cm (21-in. x 24-in. x 18-in.) plus computer Weight: Approx. 58.96 Kg (130 lb) Operating Environment Specifications: Operating Temperature: 18-22°C (64-72°F) Air Quality: Class 100 or cleaner Gas: Inert gas (argon or nitrogen) flow rate: 2-5 CFH; 0.25-in pipe with a Swagelok connector Water Temperature: Water temperature 20°C (68°F); flow rate 2-3 liters/min; pressure 2-5 psi, 0.25-in pipe with a Swagelok connector System Power: Instrument: Standard: 20 amp., 230 V, 50/60 Hz. 200-mm option: 30 amp. at 230 V, 50/60 Hz. Computer 5.4 amp., 115 V, 50/60 Hz Computer and Peripheral Specifications: Computer: AST 33 MHz, 386 DX (This unit looks to have been upgraded to a 66 MHz 486 DX2 computer) Hard Disk: 40 MB (It looks like the current HD may be 80 MB) Floppy Diskette Drive: 3.5-in. high density (1.44 MB) Printer: Hewlett-Packard Deskjet Plus recommended; parallel interface Comm. Port: One male RS232 port connector for use as SECS-II port. Note: A gender changer changer is provided for use with the standard SECS cable. (I am not sure if there is a gender changer. There does appear to be a cable that goes from DB-9 female to DB-25 male)
    配置
    The Main Unit's Serial Number Tag Reads: Model Number: FLX 2908 Power Requirements: 208 VAC, 32 A, Single Phase, 60 Hz Date Manufactured: March 19th, 1996 Software Version: WINFLX Version 4.40 Accessories: -Computer (486DX-66), Monitor, Keyboard (with trackball) -Cables -Holders for 8", 6" Round, 6" Flat, 5" Round, 5" Flat
    OEM 代工型號說明
    未提供
    文檔

    無文檔

    verified-listing-icon

    已驗證

    類別
    Thin Film / Film Thickness

    上次驗證: 超過60天前

    關鍵商品詳情

    條件:

    Used


    作業狀態:

    Deinstalled / Uncrated


    產品編號:

    133598


    晶圓尺寸:

    5"/125mm, 6"/150mm, 8"/200mm


    年份:

    1996


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    類似上架商品
    查看全部
    KLA FLX 2908

    KLA

    FLX 2908

    Thin Film / Film Thickness
    年份: 1996條件: 二手
    上次驗證超過60天前

    KLA

    FLX 2908

    verified-listing-icon
    已驗證
    類別
    Thin Film / Film Thickness
    上次驗證: 超過60天前
    listing-photo-c4d4e4717dac4b0fa4c00aa44d7a58bc-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/88001/c4d4e4717dac4b0fa4c00aa44d7a58bc/795181c08adf4eb6824b0d5670d23aa7_tencorflx290803964501measurementsystem_mw.jpg
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    關鍵商品詳情

    條件:

    Used


    作業狀態:

    Deinstalled / Uncrated


    產品編號:

    133598


    晶圓尺寸:

    5"/125mm, 6"/150mm, 8"/200mm


    年份:

    1996


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    KLA-Tencor FleXus FLX-2908 Thin Film Stress Measurement Test System Description: The Tencor FLX-2900 is a thin-film stress measurement instrument. It accurately measures the changes in the radius of curvature of the substrate caused by the deposition of a stressed thin film. Some of the features include: Accurate stress measurement on all types of films including metals, oxides, and polyimides. You can also measure stress as a function of time or temperature (maximum temperature 900°C). The software displays time-dependent and stress-temperature measurements automatically in graph form. An optical design that positions the laser scanning system below the furnace thus reducing noise during heating and cooling. This feature permits you to observe subtle changes in film stress. Inert atmosphere capability allows the measurements to be made in a controlled atmosphere of nitrogen or argon. Ability to customize parameters such as number of scan points, elastic modulus, substrate thickness, and wafer diameter in the process programs. You can also specify heating and cooling cycles for stress-temperature measurement. Ability to edit data records, plot graphs, and trend charts, and recalculate the stress for a saved ata file by changing the elastic modulus, wafer, or film thickness. Comprehensive data analysis capabilities that include calculating the biaxial modulus of elasticity and thermal expansion coefficient, displaying thermal stress superimposed on stress-temperature measurement data, file subtraction, and stress uniformity. Menus, screens, and windows are simple and easy to use. Key operation for each field is usually displayed at the bottom of the screen. Performance Specifications: Substrate Diameter: 100-mm (4-in.), 125-mm (5-in.), 150-mm (6-in.), and 200 mm (8-in.) wafers. Note the 200-mm (8-in.) wafer is an option. Measurement: Speed: 5 sec. for 150-mm wafer Range: 2 x 107 to 2 x 1010 dyne/cm2 Minimum Radius: 3.8 m Minimum Scan Step: 0.02 mm RMS Noise: < 0.0001 m-1 (radius = 10,000 m) at room temperature Maximum Points Per Scan: 1250 Temperature Range: Room temperature to 900°C Repeatability: The main source of repeatability error is the replacement accuracy of wafers. The typical Tencor Instruments 1 σ error in 1/R is 1 x 10-7 dynes/cm2 for a 1-µm film on a 525 µm silicon substrate. Thicker films and thinner substrates will result in smaller errors and thinner films and thicker substrates will result in larger errors. Operating Specifications: Light Source: Two lasers: 4-mW solid state (GaA1As) laser with wave-length 670 nm and 4-mW solid state (GaA1As) laser with wavelength 750 nm Physical Specifications: FLX-2900 Instrument: 53.3 cm x 60.9 cm x 45.7 cm (21-in. x 24-in. x 18-in.) plus computer Weight: Approx. 58.96 Kg (130 lb) Operating Environment Specifications: Operating Temperature: 18-22°C (64-72°F) Air Quality: Class 100 or cleaner Gas: Inert gas (argon or nitrogen) flow rate: 2-5 CFH; 0.25-in pipe with a Swagelok connector Water Temperature: Water temperature 20°C (68°F); flow rate 2-3 liters/min; pressure 2-5 psi, 0.25-in pipe with a Swagelok connector System Power: Instrument: Standard: 20 amp., 230 V, 50/60 Hz. 200-mm option: 30 amp. at 230 V, 50/60 Hz. Computer 5.4 amp., 115 V, 50/60 Hz Computer and Peripheral Specifications: Computer: AST 33 MHz, 386 DX (This unit looks to have been upgraded to a 66 MHz 486 DX2 computer) Hard Disk: 40 MB (It looks like the current HD may be 80 MB) Floppy Diskette Drive: 3.5-in. high density (1.44 MB) Printer: Hewlett-Packard Deskjet Plus recommended; parallel interface Comm. Port: One male RS232 port connector for use as SECS-II port. Note: A gender changer changer is provided for use with the standard SECS cable. (I am not sure if there is a gender changer. There does appear to be a cable that goes from DB-9 female to DB-25 male)
    配置
    The Main Unit's Serial Number Tag Reads: Model Number: FLX 2908 Power Requirements: 208 VAC, 32 A, Single Phase, 60 Hz Date Manufactured: March 19th, 1996 Software Version: WINFLX Version 4.40 Accessories: -Computer (486DX-66), Monitor, Keyboard (with trackball) -Cables -Holders for 8", 6" Round, 6" Flat, 5" Round, 5" Flat
    OEM 代工型號說明
    未提供
    文檔

    無文檔

    類似上架商品
    查看全部
    KLA FLX 2908

    KLA

    FLX 2908

    Thin Film / Film Thickness年份: 1996條件: 二手上次驗證:超過60天前
    KLA FLX 2908

    KLA

    FLX 2908

    Thin Film / Film Thickness年份: 1996條件: 二手上次驗證:超過60天前
    KLA FLX 2908

    KLA

    FLX 2908

    Thin Film / Film Thickness年份: 1996條件: 二手上次驗證:超過60天前