描述
Tool does have TSV. Tool doesn’t have a TTV (total thickness variation) function.配置
Vacuum wafer chuck for 150mm and 200mm wafer CWL spectrometer 4kHz CWL 600µm sensor CWL FT (10µm) sensor head MHU (wafer handing unit) for 150mm and 200mm Semi standard wafer Prealigner Acquire Automation XT software packages: Film thickness; Step height; Bumps measurement (height, coplanarity, diameter); Roughness;OEM 代工型號說明
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FORM FACTOR / CASCADE MICROTECH / FRT
MICROPROF 200
已驗證
類別
Thin Film / Film Thickness
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
111618
晶圓尺寸:
6"/150mm, 8"/200mm
年份:
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
FORM FACTOR / CASCADE MICROTECH / FRT
MICROPROF 200
類別
Thin Film / Film Thickness
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
111618
晶圓尺寸:
6"/150mm, 8"/200mm
年份:
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Tool does have TSV. Tool doesn’t have a TTV (total thickness variation) function.配置
Vacuum wafer chuck for 150mm and 200mm wafer CWL spectrometer 4kHz CWL 600µm sensor CWL FT (10µm) sensor head MHU (wafer handing unit) for 150mm and 200mm Semi standard wafer Prealigner Acquire Automation XT software packages: Film thickness; Step height; Bumps measurement (height, coplanarity, diameter); Roughness;OEM 代工型號說明
未提供文檔
無文檔