The CHA Mark 50 is a high vacuum deposition system that has become the industry standard due to its simplicity in design, ease of operation and unmatched reliability. It’s an excellent choice for a wide range of applications. he CHA Mark 50 has a horizontal 32" by 32" water-cooled cylindrical chamber that simplifies loading and unloading. It also has a unique slide down front door that minimizes floor space requirements and a rear door that offers easy chamber access from behind for convenient through the wall mounting. It is SECS/GEM and CE compliant. Some of its features include dual operation (sputtering and evaporation), moving substrates, exceptional film uniformity (fixture dependent), sputter up process stations, round cathodes (RF or DC, up to 4 stations), co-deposit bias (RF or DC), substrate heating (400°C, multi-element), electron beam, thermal ion beam pre-clean/etch, plasma texturing/etch and power supply options.