The CHA MARK 40 is a highly efficient and flexible vacuum deposition system that supports dual operation, including sputtering and evaporation processes. It is designed to handle moving substrates, allowing for continuous and precise deposition of thin films on various materials. The system offers exceptional film uniformity, although the results may depend on the specific fixture used.


MARK 40

The CHA Mark 50 is an industry-standard high vacuum deposition system known for its simplicity, ease of operation, and unmatched reliability, making it an excellent choice for a wide range of applications. The system features a horizontal 32" by 32" water-cooled cylindrical chamber, facilitating easy loading and unloading. Its unique slide-down front door minimizes floor space requirements, and a rear door provides convenient access to the chamber from behind, allowing for through-the-wall mounting. The Mark 50 is SECS/GEM and CE compliant, ensuring compatibility with modern manufacturing standards. It offers dual operation capabilities for sputtering and evaporation, accommodates moving substrates, and provides exceptional film uniformity (fixture dependent). The system supports up to 4 process stations with round cathodes (RF or DC) and co-deposition capability. Additionally, it includes bias (RF or DC), substrate heating up to 400°C with multi-element options, electron beam, thermal deposition, ion beam pre-clean/etch, and plasma texturing/etch functionalities.
-Dual Operation, Sputtering and Evaporation
-Moving substrates
-Exceptional Film Uniformity (Fixture Dependent)
-Sputter Up
-Process Stations
-Round Cathodes, RF or DC (Up to 4 Stations)
-Co-deposit
-Bias, RF or DC
-Substrate heating, 400°C, multi-element
-Substrate heating, station
-Electron beam
-Thermal
-Ion beam pre-clean/etch
-Plasma texturing/etch

MARK 50

RESOLUTION

SEC 1000

SE-600

SEC 1000-RAP

SE 600 RAP

SEC 600-RAP

CHA'S multi-process High Vacuum Web/Roll Coating Systems are designed to coat mylar, foil, and other thin plastic or metallic materials stored in continuous roll form. Systems are available with a wide range of options covering the spectrum from full computer control to operator control and from production runs to small R & D quantities. CHA field-proven High Vacuum Deposition Systems have set worldwide standards in semiconductor; magnetic media, and optical coating applications. CHA Systems are economical, feature fast loading and unloading, offer broad process flexibility, and are equally productive in both sputtering and evaporation processing.

MARK 80

TEMESCAL FC1800

The CHA Mark 50 is a high vacuum deposition system that has become the industry standard due to its simplicity in design, ease of operation and unmatched reliability. It’s an excellent choice for a wide range of applications. he CHA Mark 50 has a horizontal 32" by 32" water-cooled cylindrical chamber that simplifies loading and unloading. It also has a unique slide down front door that minimizes floor space requirements and a rear door that offers easy chamber access from behind for convenient through the wall mounting. It is SECS/GEM and CE compliant. Some of its features include dual operation (sputtering and evaporation), moving substrates, exceptional film uniformity (fixture dependent), sputter up process stations, round cathodes (RF or DC, up to 4 stations), co-deposit bias (RF or DC), substrate heating (400°C, multi-element), electron beam, thermal ion beam pre-clean/etch, plasma texturing/etch and power supply options.

MARK 50C

The CHA MARK 40C-RH is a vacuum deposition system that combines the best features of CHA Industries’ Mark 50 system with a broad array of options. It offers efficiency, flexibility and ease of maintenance. It accommodates a wide variety of deposition equipment, including versatile combinations of deposition sources and substrates fixturing to address virtually any application. 
RH = Right Handed
PC/PLC Controller

MARK 40C 

SE 1000

IH-600	

The CHA MARK 50C RH is an industry-standard high vacuum deposition system known for its simplicity, user-friendly operation, and outstanding reliability. It is a preferred choice for various applications due to its efficient design. The system features a horizontal 32" by 32" water-cooled cylindrical chamber, making loading and unloading processes straightforward. The slide-down front door minimizes floor space requirements, while a rear door allows easy access to the chamber from behind, facilitating convenient through-the-wall mounting. The system is SECS/GEM and CE compliant, ensuring compatibility with modern manufacturing standards.
RH = Right Handed
PC/PLC Controller

CHA

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