描述
無描述配置
無配置OEM 代工型號說明
The FEI V600CE is a focused ion beam (FIB) system designed for fast, efficient, and cost-effective circuit editing on advanced integrated circuits at the 65 nm technology node and beyond. It incorporates the latest developments in ion column design, gas delivery, and end point detection. Circuit editing allows product designers to reroute conductive pathways and test modified circuits in hours, rather than the weeks or months required to generate new masks and process new wafers. This results in fewer, shorter modification and test cycles, allowing manufacturers to ramp up new processes faster and be first to market with premium-priced new products. The V600CE is specifically designed to meet the challenges of advanced designs and processes, including smaller geometries, higher circuit densities, exotic materials, and complex interconnect structures. It can also be configured for backside editing with an optional IR microscope and bulk silicon trenching package.文檔
無文檔
THERMOFISHER SCIENTIFIC / FEI / PHILLIPS
V600CE
已驗證
類別
TEM
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
13347
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
THERMOFISHER SCIENTIFIC / FEI / PHILLIPS
V600CE
類別
TEM
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
13347
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
無配置OEM 代工型號說明
The FEI V600CE is a focused ion beam (FIB) system designed for fast, efficient, and cost-effective circuit editing on advanced integrated circuits at the 65 nm technology node and beyond. It incorporates the latest developments in ion column design, gas delivery, and end point detection. Circuit editing allows product designers to reroute conductive pathways and test modified circuits in hours, rather than the weeks or months required to generate new masks and process new wafers. This results in fewer, shorter modification and test cycles, allowing manufacturers to ramp up new processes faster and be first to market with premium-priced new products. The V600CE is specifically designed to meet the challenges of advanced designs and processes, including smaller geometries, higher circuit densities, exotic materials, and complex interconnect structures. It can also be configured for backside editing with an optional IR microscope and bulk silicon trenching package.文檔
無文檔