
描述
Nikon Arf lithography machine uses 193nm wavelength ArF excimer laser for exposure, which is suitable for advanced semiconductor manufacturing processes. It can support the current mainstream 12-inch wafer production, and is also suitable for the production of 8-inch wafers. It can achieve smaller feature sizes and plays a vital role in improving chip performance and integration. It provides semiconductor manufacturers with high-precision and high-production efficiency solutions.配置
Scanning 0.07 0.92 4:1 26*33 12OEM 代工型號說明
NSR-S308F (resolution ≦ 65 nm). The NSR-308F has a newly developed platform that enables dramatic improvements in alignment accuracy and throughput. Alignment accuracy has been reduced to 8 nm or less, a 44% improvement over Nikon’s previous generation ArF scanner, while throughput was increased to 140 wafers or more per hour for 300 mm wafers, an improvement of approximately 25%. With this significant increase in productivity, the system delivers next-generation process capabilities at a lower overall cost of ownership.文檔
無文檔
NIKON
NSR-S308F
類別
Steppers & Scanners
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
131677
晶圓尺寸:
8"/200mm, 12"/300mm
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Nikon Arf lithography machine uses 193nm wavelength ArF excimer laser for exposure, which is suitable for advanced semiconductor manufacturing processes. It can support the current mainstream 12-inch wafer production, and is also suitable for the production of 8-inch wafers. It can achieve smaller feature sizes and plays a vital role in improving chip performance and integration. It provides semiconductor manufacturers with high-precision and high-production efficiency solutions.配置
Scanning 0.07 0.92 4:1 26*33 12OEM 代工型號說明
NSR-S308F (resolution ≦ 65 nm). The NSR-308F has a newly developed platform that enables dramatic improvements in alignment accuracy and throughput. Alignment accuracy has been reduced to 8 nm or less, a 44% improvement over Nikon’s previous generation ArF scanner, while throughput was increased to 140 wafers or more per hour for 300 mm wafers, an improvement of approximately 25%. With this significant increase in productivity, the system delivers next-generation process capabilities at a lower overall cost of ownership.文檔
無文檔