描述
-Dimension 1650x990x1700mm LxWxH配置
-Voltage 3x380V+N+PE -2 Hetated, 2 Unheated Tanks -280er Chamber for 25 Wafers 8“ -Tank 1,2 was used for EKC 265, Tank 3,4 for IPA -2x Fume Sensors -4x Trebor PumpsOEM 代工型號說明
The Spray Solvent Tool (SST) is a compact, efficient system that enhances chemical reactions on wafer surfaces. It employs mechanical and centrifugal forces to achieve uniform coverage on both sides of the wafer. The closed loop process control ensures consistent results, while continuous recycling and filtration of chemicals reduce waste. The SST offers precise temperature control and flexibility in chemical delivery methods. With its high throughput, small footprint, and operator safety features, it provides reliable and low-maintenance operation. The tool supports various processes, including GaAs clean, metal lift-off, photoresist removal, post-etch residue removal, and thin film heads. It utilizes technologies such as copper RDL and pillar structures. Flexibility - featuring two, four, or seven tank configuration in small footprint cabinet; process chambers, product carriers, and quick-disconnect rotors are available for wafers up to 200mm文檔
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SEMITOOL
SST 421
類別
Spray Solvent / Acid
上次驗證: 20 天前
關鍵商品詳情
條件:
Refurbished
作業狀態:
未知
產品編號:
137244
晶圓尺寸:
8"/200mm
年份:
1998
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
-Dimension 1650x990x1700mm LxWxH配置
-Voltage 3x380V+N+PE -2 Hetated, 2 Unheated Tanks -280er Chamber for 25 Wafers 8“ -Tank 1,2 was used for EKC 265, Tank 3,4 for IPA -2x Fume Sensors -4x Trebor PumpsOEM 代工型號說明
The Spray Solvent Tool (SST) is a compact, efficient system that enhances chemical reactions on wafer surfaces. It employs mechanical and centrifugal forces to achieve uniform coverage on both sides of the wafer. The closed loop process control ensures consistent results, while continuous recycling and filtration of chemicals reduce waste. The SST offers precise temperature control and flexibility in chemical delivery methods. With its high throughput, small footprint, and operator safety features, it provides reliable and low-maintenance operation. The tool supports various processes, including GaAs clean, metal lift-off, photoresist removal, post-etch residue removal, and thin film heads. It utilizes technologies such as copper RDL and pillar structures. Flexibility - featuring two, four, or seven tank configuration in small footprint cabinet; process chambers, product carriers, and quick-disconnect rotors are available for wafers up to 200mm文檔
無文檔