– It is a FE SEM with Ga FIB column, airlock, Kliendiek MM3 micro-manipulator, and multi-chemistry gas-injection system (currently it runs C and W for depositions, though it has capacity for others in non-heated precursor chambers). 
– It is also set up with a Leica VCT100 cryo-stage, though the interlock is currently not functional (can still be used for cryo during milling, but requires samples to be loaded and unloaded at room temperature and in atmosphere).  – Oxford EDS system

ZEISS is the global technology leader in the production of systems and modules for microchip production. With semiconductor manufacturing optics, photomask systems and process control solutions, ZEISS supplies key technologies for the production of ultra-fine conductor track structures on silicon wafers – the raw material used to make microchips. Advances in computer technology largely rely on the ongoing development of optical lithography – every new generation enables even finer structures to be produced on the microchips. This makes circuits more compact, resulting in more powerful and more energy-efficient microchips every year. ZEISS has been driving the development of semiconductor manufacturing technology right from day one. ZEISS’ new and unique extreme ultraviolet (EUV) lithography has created a series of further generations of microchips with ever greater integration density and performance.

ZEISS / CARL ZEISS

The NVision 40 operates with two beams, one electron beam and one ion beam. Both beams can be used independently of each other to generate images using the secondary electrons emitted from the surface of the specimen. The ion beam can be used for imaging in addition material removal or coating purposes.

ZEISS / CARL ZEISS

NVision 40

SEM / FIB

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NVision 40

SEM / FIB

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