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CT1000

類別
SEM / FIB
概述

The 3D SEM*1 CT1000 enables 3D observation of pattern and defects shapes that occur during the manufacturing process on wafers up to 8 inches (200 mm) in diameter, with a feature to analyze the elemental composition of objects being observed. This product will help to contribute to the quality assurance on IoT (Internet of Things) and in-vehicle automotive semiconductor devices.

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