描述
無描述配置
無配置OEM 代工型號說明
The Helios NanoLab 600 is a Dual Beam FIB/SEM (Focused Ion Beam/Scanning Electron Microscope) that is designed for high-end imaging during failure analysis. It features an extreme high-resolution column, a fine-probe ion source, and a 150 x 150 mm, five-axis, XY piezo stage. This makes it a smart investment for failure-analysis labs that require versatile sample handling, from packaged parts to eight-inch wafers. The Helios NanoLab 600 is particularly useful for cross-sectioning samples and delivers three-dimensional imaging, allowing you to quickly and efficiently locate and view device features from different angles. Additionally, patented beam chemistries can be used to highlight interface layers for imaging in the system, providing you with the most accurate data possible without additional preparation steps outside the system.文檔
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THERMOFISHER SCIENTIFIC / FEI / PHILLIPS
HELIOS NANOLAB 600
已驗證
類別
SEM / FIB
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
84145
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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THERMOFISHER SCIENTIFIC / FEI / PHILLIPS
HELIOS NANOLAB 600
類別
SEM / FIB
上次驗證: 超過30天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
84145
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
無配置OEM 代工型號說明
The Helios NanoLab 600 is a Dual Beam FIB/SEM (Focused Ion Beam/Scanning Electron Microscope) that is designed for high-end imaging during failure analysis. It features an extreme high-resolution column, a fine-probe ion source, and a 150 x 150 mm, five-axis, XY piezo stage. This makes it a smart investment for failure-analysis labs that require versatile sample handling, from packaged parts to eight-inch wafers. The Helios NanoLab 600 is particularly useful for cross-sectioning samples and delivers three-dimensional imaging, allowing you to quickly and efficiently locate and view device features from different angles. Additionally, patented beam chemistries can be used to highlight interface layers for imaging in the system, providing you with the most accurate data possible without additional preparation steps outside the system.文檔
無文檔