概述

The Defect Analyzer 300 is an advanced 300 mm DualBeam system designed for in-fab structural diagnostics. It can accommodate either 300 mm or 200 mm wafers and delivers a powerful combination of tool automation, industry-leading electron imaging, unsurpassed focused ion beam milling, and proprietary beam chemistry technology. This enables three-dimensional analysis of advanced process defects, resulting in better control over advanced processes, reduced time-to-market, and drastically reduced process development costs.