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描述
6S Auto AOI After Saw Singulation with Wafer Sorter -Pickup force: 50~150g -Dimension: 2950(W)x1550(D)x1650(H) mm /x 2130mm(H) withmsignal tower / weight < 3800Kg配置
-Machine Cycle Time: ≦ 0.6 sec/chip (exclude process time) -Accuracy: X,Y= ± 40μm , θ=± 0.2° -Chip size: 0.7mm～10 mm (option: customized) -Die Thickness: 0.10 mm～0.7 mm (2mil Option) -Wafer Size: 12” Standard (8” Option) -Wafer Load/Unload: Automatic -Mapping: Easy mapping / file mapping -Ejector Needle: Dual needle unit / Programmable Speed & Height control Option Function: -Topside /Backside insp. Chipping, Crack, Residue glue , defect size>10um -Side wall inspection Chipping, Crack, defect size>10um (option) -inspection resolution 2.7um/pixel -Wafer Ring for place 12” Standard (8” Option) feeding by 12” XY table -Ring Load/Unload 12” wafer ring auto load/unload by Cassette -NG die output Place bad die(by inspection)on tray for rework or -review (Option: 6” film frame) -Barcode reader For mapping file confirming -SECS For mapping data transfer (option)OEM 代工型號說明
未提供文檔
GMM
6S
類別
Scribing, Cutting, Dicing
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
46623
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available