描述
Wafer Scriber/Breaker For Scribing & Breaking of up to 4” Wafers Chip Free™ Breaking Mechanism Uses Impact Breaking System Minimum Die Size: 0.005” Square (125µ) Wafer Thickness Range: 0.004” (100µ) to 0.039” (975µ) CCD Camera Alignment System DOS Operating System Operators and Maintenance Manuals Facilities Required: Input Voltage: 115VAC, 60Hz, 5A CDA or N2: 60-85 PSIG, 0.5 CFM Vacuum: 15-28 In. Hg, 0.5 CFM配置
Missing Hard Drive/Computer The rest of the tool is fully functionalOEM 代工型號說明
未提供文檔
無文檔
DYNATEX
DX-III
已驗證
類別
Scribing, Cutting, Dicing
上次驗證: 超過60天前
關鍵商品詳情
條件:
Parts Tool
作業狀態:
未知
產品編號:
19568
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
DYNATEX
DX-III
類別
Scribing, Cutting, Dicing
上次驗證: 超過60天前
關鍵商品詳情
條件:
Parts Tool
作業狀態:
未知
產品編號:
19568
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Wafer Scriber/Breaker For Scribing & Breaking of up to 4” Wafers Chip Free™ Breaking Mechanism Uses Impact Breaking System Minimum Die Size: 0.005” Square (125µ) Wafer Thickness Range: 0.004” (100µ) to 0.039” (975µ) CCD Camera Alignment System DOS Operating System Operators and Maintenance Manuals Facilities Required: Input Voltage: 115VAC, 60Hz, 5A CDA or N2: 60-85 PSIG, 0.5 CFM Vacuum: 15-28 In. Hg, 0.5 CFM配置
Missing Hard Drive/Computer The rest of the tool is fully functionalOEM 代工型號說明
未提供文檔
無文檔