待售二手貨 DISCO DFL7361

描述

The wavelength: 1342nm Laser current hour used: 22032.32hrs

配置

· Accommodates up to 12-inch wafers · Automatic handling · Auto-alignment · High speed X axis capable of 1000mm/sec · 380° rotational theta axis · Hard disk allows the user to store 1000 different device programs · Window XP based Graphical User Interface · Touch panel display · SDE01 Laser Engine · Standard IR Camera · SDE06 Laser Head · IR Camera for full Thick wafers up to 1mm (replaces standard IR camera) · 25 Character Recipe name · SECS GEM · Additional Host Monitor, keyboard stand, and cable port addition · Wafer ID reader · Clean Unit Hepa Processing Section · Clean Unit Hepa Transfer Section · Frame Handling and Wafer Handling Option · Vacuum Retention and SG140154-0. · SD Through Tape in Manual Mode. Wafer transfer (Standard specification) : ①The workpiece is withdrawn from the cassette by the wafer pick and transferred to the load table ②The workpiece is transferred to the chuck table by the rotation arm → laser processing ③The workpiece is transferred to the unload table by the rotation arm ④The workpiece is returned to the cassette by the frame pick

OEM 代工型號說明

The Disco-DFL7361 is a laser saw developed by Disco Corporation. It uses a processing method called Stealth Dicing, which focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander. This method controls cutting waste because only a subsurface layer is processed, making it suitable for workpieces that are vulnerable to contamination.