描述
The laser head is new. System is working condition.配置
Laser type： Laser grooving for Si Laser head： FX Laser path： BSS6OEM 代工型號說明
The DFL7161 is a fully automatic laser saw for Φ300 mm wafers. It has a maximum processing range of 310 mm on both the X and Y axes and can move at speeds between 1 and 1,000 mm/s on the X-axis. The Z-axis has a moving resolution of 0.000015 mm and a repeatability accuracy of 0.002 mm. The θ-axis (Chuck table) has a maximum rotating angle of 330 degrees (standard) or 380 degrees (option). The equipment dimensions are 1,560 × 1,550 × 1,800 mm (W×D×H) and it weighs approximately 2,300 kg.文檔
無文檔
DISCO
DFL7161
已驗證
類別
Scribing, Cutting, Dicing
上次驗證: 20 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
115179
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
DISCO
DFL7161
類別
Scribing, Cutting, Dicing
上次驗證: 20 天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
115179
晶圓尺寸:
未知
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
The laser head is new. System is working condition.配置
Laser type： Laser grooving for Si Laser head： FX Laser path： BSS6OEM 代工型號說明
The DFL7161 is a fully automatic laser saw for Φ300 mm wafers. It has a maximum processing range of 310 mm on both the X and Y axes and can move at speeds between 1 and 1,000 mm/s on the X-axis. The Z-axis has a moving resolution of 0.000015 mm and a repeatability accuracy of 0.002 mm. The θ-axis (Chuck table) has a maximum rotating angle of 330 degrees (standard) or 380 degrees (option). The equipment dimensions are 1,560 × 1,550 × 1,800 mm (W×D×H) and it weighs approximately 2,300 kg.文檔
無文檔