描述
AUTOMATIC DICNG SAW配置
無配置OEM 代工型號說明
The A-WD-10A is a compact wafer dicing machine capable of dicing wafers up to 160 mm square in size. It features a smooth grinding feed and a high reliability power spindle, making it a reliable and efficient choice for your wafer dicing needs.文檔
無文檔
ACCRETECH / TSK
A-WD-10A
已驗證
類別
Scribing, Cutting, Dicing
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
69282
晶圓尺寸:
未知
年份:
2001
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ACCRETECH / TSK
A-WD-10A
類別
Scribing, Cutting, Dicing
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
69282
晶圓尺寸:
未知
年份:
2001
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
AUTOMATIC DICNG SAW配置
無配置OEM 代工型號說明
The A-WD-10A is a compact wafer dicing machine capable of dicing wafers up to 160 mm square in size. It features a smooth grinding feed and a high reliability power spindle, making it a reliable and efficient choice for your wafer dicing needs.文檔
無文檔