描述
Platform RTP Equipment配置
Two Chamber Radox 2 SystemOEM 代工型號說明
The Applied Vantage RadOx RTP, using its oxidation chemistry, cultivates a dense, top-tier oxide in minimal thermal budgets. This system surpasses scaling challenges for essential oxidation processes like memory gate oxide and ONO stack, among others. Ensuring tight thermal regulation and in-process supervision, RadOx provides industry-leading oxide quality in the Radiance chamber on the highly efficient Vantage platform. This platform, characterized by its compact design and plug-and-play installation, leverages a unique radical-based oxidation method and boasts an extendible, low-pressure capability for cutting-edge thermal processing.Proprietary radical-based oxidation process Tight thermal budget control and in-process monitoring Extendible, reduced-pressure capability for advanced device thermal processing High productivity, small footprint Vantage platform with plug-and-play install design文檔
無文檔
APPLIED MATERIALS (AMAT)
VANTAGE RADOX
已驗證
類別
RTP/RTA
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
48002
晶圓尺寸:
12"/300mm
年份:
未知
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
VANTAGE RADOX
已驗證
類別
RTP/RTA
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
48002
晶圓尺寸:
12"/300mm
年份:
未知
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Platform RTP Equipment配置
Two Chamber Radox 2 SystemOEM 代工型號說明
The Applied Vantage RadOx RTP, using its oxidation chemistry, cultivates a dense, top-tier oxide in minimal thermal budgets. This system surpasses scaling challenges for essential oxidation processes like memory gate oxide and ONO stack, among others. Ensuring tight thermal regulation and in-process supervision, RadOx provides industry-leading oxide quality in the Radiance chamber on the highly efficient Vantage platform. This platform, characterized by its compact design and plug-and-play installation, leverages a unique radical-based oxidation method and boasts an extendible, low-pressure capability for cutting-edge thermal processing.Proprietary radical-based oxidation process Tight thermal budget control and in-process monitoring Extendible, reduced-pressure capability for advanced device thermal processing High productivity, small footprint Vantage platform with plug-and-play install design文檔
無文檔