描述
無描述配置
Centura RTP XE+ ReactorsOEM 代工型號說明
The Centura RTP XE is a market-leading thermal processing tool that has recently been enhanced to create the new RTP XEplus Centura. This new version offers increased throughput and new application capabilities, including the ability to perform ultra-shallow junction formation using the Implant xR LEAP™ and RTP XEplus Centura. In addition to the RTP XEplus Centura, there are several other LPCVD product offerings available, including the Poly Centura, DCS xZ™ tungsten silicide chamber, and the Polycide xZ Centura for cost-effective integrated tungsten silicide and poly processing. For capacitor solutions, the recently-introduced Tanox xZ Centura offers high-productivity tantalum oxide deposition. These tools provide a range of options for thermal processing and other applications in semiconductor manufacturing.文檔
無文檔
類別
RTP/RTA
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
133389
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
CENTURA RTP XE Plus
類別
RTP/RTA
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
133389
晶圓尺寸:
未知
年份:
未知
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
無描述配置
Centura RTP XE+ ReactorsOEM 代工型號說明
The Centura RTP XE is a market-leading thermal processing tool that has recently been enhanced to create the new RTP XEplus Centura. This new version offers increased throughput and new application capabilities, including the ability to perform ultra-shallow junction formation using the Implant xR LEAP™ and RTP XEplus Centura. In addition to the RTP XEplus Centura, there are several other LPCVD product offerings available, including the Poly Centura, DCS xZ™ tungsten silicide chamber, and the Polycide xZ Centura for cost-effective integrated tungsten silicide and poly processing. For capacitor solutions, the recently-introduced Tanox xZ Centura offers high-productivity tantalum oxide deposition. These tools provide a range of options for thermal processing and other applications in semiconductor manufacturing.文檔
無文檔