描述
Pictures attached were taken before tool was crated.配置
無配置OEM 代工型號說明
The SEMILAB / SDI FAAST 230 DP+SPV is an inspection system for wafer masks that can handle cassettes of up to 200mm wafers. It is designed to quickly monitor heavy metal contamination in a non-contact, in-line manner, including the detection of sub 10^8 atoms/cm^-3 Fe. The system is suitable for medium to high-volume manufacturing environments and features automated wafer handling. It also includes automatic robotic wafer handling, a single open-cassette wafer loading station with various configurable options, and automatic full wafer FAST mapping of diffusion length, Iron, and other recombination centers. Additionally, it has the option for advanced digital SPV functions such as Backsurface Recombination, Steady State Diffusion Length, and Copper measurements.文檔
無文檔
SEMILAB / SDI
FAAST 230 DP+SPV
已驗證
類別
Reticle / Mask Inspection
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
Deinstalled / Crated
產品編號:
27530
晶圓尺寸:
未知
年份:
1999
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SEMILAB / SDI
FAAST 230 DP+SPV
類別
Reticle / Mask Inspection
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
Deinstalled / Crated
產品編號:
27530
晶圓尺寸:
未知
年份:
1999
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Pictures attached were taken before tool was crated.配置
無配置OEM 代工型號說明
The SEMILAB / SDI FAAST 230 DP+SPV is an inspection system for wafer masks that can handle cassettes of up to 200mm wafers. It is designed to quickly monitor heavy metal contamination in a non-contact, in-line manner, including the detection of sub 10^8 atoms/cm^-3 Fe. The system is suitable for medium to high-volume manufacturing environments and features automated wafer handling. It also includes automatic robotic wafer handling, a single open-cassette wafer loading station with various configurable options, and automatic full wafer FAST mapping of diffusion length, Iron, and other recombination centers. Additionally, it has the option for advanced digital SPV functions such as Backsurface Recombination, Steady State Diffusion Length, and Copper measurements.文檔
無文檔