描述
Spare Parts配置
無配置OEM 代工型號說明
System enables fully automated inspection of the 300mm wafer surface. The system's parallel processing capability allows simultaneous wafer inspection of the front / backside and the edge/bevel – at throughputs of up to 130 wafers per hour. A single rotation of the wafer is sufficient for wafer edge inspection to deliver the detection results and defect images. The image-based technology convinces with 1µm sensitivity and allows for optional high resolution microscopic review of defects.文檔
無文檔
KLA / VISTEC / LEICA
LDS3300 C
已驗證
類別
Reticle / Mask Inspection
上次驗證: 超過60天前
關鍵商品詳情
條件:
Parts Tool
作業狀態:
未知
產品編號:
101281
晶圓尺寸:
2"/50mm
年份:
2023
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KLA / VISTEC / LEICA
LDS3300 C
類別
Reticle / Mask Inspection
上次驗證: 超過60天前
關鍵商品詳情
條件:
Parts Tool
作業狀態:
未知
產品編號:
101281
晶圓尺寸:
2"/50mm
年份:
2023
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
Spare Parts配置
無配置OEM 代工型號說明
System enables fully automated inspection of the 300mm wafer surface. The system's parallel processing capability allows simultaneous wafer inspection of the front / backside and the edge/bevel – at throughputs of up to 130 wafers per hour. A single rotation of the wafer is sufficient for wafer edge inspection to deliver the detection results and defect images. The image-based technology convinces with 1µm sensitivity and allows for optional high resolution microscopic review of defects.文檔
無文檔