描述
No missing parts System was shutdown according to normal procedure Stage air bearing was damaged before shutting down配置
LDS3300M Macro-Module 30um Head - sensitivity for surface defects down to 10um 100% Wafer Surface Inspection 200mm+300mm - Bare & Pattern Wafers Throughput 200mm - 140 WPH 300mm - 130 WPHOEM 代工型號說明
未提供文檔
無文檔
KLA / VISTEC / LEICA
LDS 3300M
已驗證
類別
Reticle / Mask Inspection
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
23604
晶圓尺寸:
8"/200mm, 12"/300mm
年份:
2007
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
類似上架商品
查看全部KLA / VISTEC / LEICA
LDS 3300M
類別
Reticle / Mask Inspection
上次驗證: 超過60天前
關鍵商品詳情
條件:
Used
作業狀態:
未知
產品編號:
23604
晶圓尺寸:
8"/200mm, 12"/300mm
年份:
2007
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
描述
No missing parts System was shutdown according to normal procedure Stage air bearing was damaged before shutting down配置
LDS3300M Macro-Module 30um Head - sensitivity for surface defects down to 10um 100% Wafer Surface Inspection 200mm+300mm - Bare & Pattern Wafers Throughput 200mm - 140 WPH 300mm - 130 WPHOEM 代工型號說明
未提供文檔
無文檔