跳到主要內容
Moov logo

Moov Icon
KLA OmniMap RS75/tc
    描述
    無描述
    配置
    無配置
    OEM 代工型號說明
    The OmniMap® RS75/tc is a resistivity mapping system designed to help semiconductor manufacturers perform accurate wafer characterization and critical production monitoring at substantially greater speeds. It addresses a wide variety of process applications where film thickness and sheet resistance are critical, such as ion implantation, metallization, diffusion, epitaxy and polysilicon. The RS75/tc model incorporates a patented temperature compensation (tc) solution, allowing the system to correct for temperature variations, dramatically affecting long-term repeatability, accuracy, and system-to-system matching. With measurement speed of approximately 1 second per test site, the tool can process a 25-slot cassette of 200mm wafers at over 100 wafers per hour. This includes five-site monitoring, with automatic temperature compensation and flat alignment. The RS75 series is offered in a variety of configurations to meet customer production requirements.
    文檔

    無文檔

    類別
    Resistivity / Four Point Probe

    上次驗證: 昨日

    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    129709


    晶圓尺寸:

    6"/150mm, 8"/200mm


    年份:

    2003


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available

    KLA

    OmniMap RS75/tc

    verified-listing-icon
    已驗證
    類別
    Resistivity / Four Point Probe
    上次驗證: 昨日
    listing-photo-ec2404d93705485b8e9433f39ab8157d-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    關鍵商品詳情

    條件:

    Used


    作業狀態:

    未知


    產品編號:

    129709


    晶圓尺寸:

    6"/150mm, 8"/200mm


    年份:

    2003


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    描述
    無描述
    配置
    無配置
    OEM 代工型號說明
    The OmniMap® RS75/tc is a resistivity mapping system designed to help semiconductor manufacturers perform accurate wafer characterization and critical production monitoring at substantially greater speeds. It addresses a wide variety of process applications where film thickness and sheet resistance are critical, such as ion implantation, metallization, diffusion, epitaxy and polysilicon. The RS75/tc model incorporates a patented temperature compensation (tc) solution, allowing the system to correct for temperature variations, dramatically affecting long-term repeatability, accuracy, and system-to-system matching. With measurement speed of approximately 1 second per test site, the tool can process a 25-slot cassette of 200mm wafers at over 100 wafers per hour. This includes five-site monitoring, with automatic temperature compensation and flat alignment. The RS75 series is offered in a variety of configurations to meet customer production requirements.
    文檔

    無文檔